For the most part, integrated circuits (ICs) consist of three types of packages. The large plastic molded packages are the most widely used. The molded DIPs (dual in-line packages) are used chiefly for 4-layer logic and memory devices. QFPs (quad flat packs) are used for many high-density devices.

ICs have come a long way since the first one was produced over six decades ago. As the name implies, ICs combine multiple electronic components, all contained within a single package. These packages are so small they can now be found in virtually every electronic device created today, ranging from smartphones and laptops to cars and microwaves. The history of integrated circuit is the history of modern electronics.

Although the term "integrated circuit" was initially used to describe devices like microchips, the term can today refer to any electronic circuit that has been built on a single substrate. Integrated circuits -- or IC's -- are used in just about every electrical device you can think of. The most common IC's are microchips, which contain millions of transistors.

Dual in-line packages

Dual in-line packages (DIP) are a type of integrated circuit packaging used for integrated circuits. Two closely spaced rows of rectangular holes are etched into a flat rectangular piece of silicon or other semiconductor material. Each row is known as a "plane" and is numbered sequentially, starting with the topmost plane (closest to the device's exposed copper leads) as "plane 0", progressing downward in an alternating fashion. If a leader is revealed in the topmost (or bottommost) plane, the device is known as a flat pack.

Quad flat packs

Quad Flat Pack (QFP) Integrated Circuits (ICs) use many small chips and other electronic components in the same package. They are much easier to handle than any other ICs. They are also cheaper to manufacture when the demand is high.

Ball Grid Array Package

The ball grid array (BGA) package is a type of integrated circuit package containing a die and balls placed on the surface of the chip. BGA packages protect the fragile die from failure, allow for denser packaging of the ICs, and are therefore used in applications where more connections are present. The balls on the BGA are placed on the underside of the chip and are connected to the circuitry on the top of the chip. The balls are formed from gold and are typically arranged in a 12×12 or 8×8 array, with a pitch of either 50 or 200 μm.

Small Outline Package

The Small Outline Package (SOP) is a family of integrated circuit packages with three, four, six, or eight terminals. Some variants may have more than eight terminals, but typically these are not considered SOP packages, as they are not regular rectangular shapes. The terminals are usually arranged as two rows of three pins. However, some packages have terminals in a single row along one edge of the package, with the component's leads extending out from the other edges. The SOP package is similar to the larger plastic dual in-line package (PDIP), used for integrated circuits such as microprocessors. The SOP package is often used to house integrated circuits with medium to high levels of complexity.